SMT貼(tie)片(pian)(pian)加(jia)工(gong)工(gong)藝(yi)流(liu)(liu)程：單(dan)面組裝(zhuang)(zhuang)：來料檢測(ce)(ce)+絲印(yin)+錫膏（紅(hong)(hong)膠(jiao)）+貼(tie)片(pian)(pian)+回流(liu)(liu)(固(gu)化)+清(qing)(qing)(qing)洗(xi)(xi)+檢測(ce)(ce)+返修(xiu)，單(dan)面混裝(zhuang)(zhuang)：來料檢測(ce)(ce)+PCB的A面絲印(yin)錫膏（紅(hong)(hong)膠(jiao)）+貼(tie)片(pian)(pian)+A面回流(liu)(liu)(固(gu)化)+清(qing)(qing)(qing)洗(xi)(xi)+插件+波峰(feng)(feng)+清(qing)(qing)(qing)洗(xi)(xi)+檢測(ce)(ce)+返修(xiu)，雙面組裝(zhuang)(zhuang)：來料檢測(ce)(ce)+PCB的A面絲印(yin)錫膏（紅(hong)(hong)膠(jiao)）+貼(tie)片(pian)(pian)+A面回流(liu)(liu)(固(gu)化)+清(qing)(qing)(qing)洗(xi)(xi)+翻板(ban)+B面絲印(yin)錫膏（紅(hong)(hong)膠(jiao)）+貼(tie)片(pian)(pian)+B面回流(liu)(liu)(固(gu)化)或(huo)是(DIP+波峰(feng)(feng))+清(qing)(qing)(qing)洗(xi)(xi)+檢測(ce)(ce)+返修(xiu)。

SMT貼(tie)(tie)片(pian)(pian)(pian)加(jia)工(gong)(gong)(gong)作為一(yi)門高精密(mi)的(de)(de)技術，對(dui)于(yu)(yu)工(gong)(gong)(gong)藝要求(qiu)也十(shi)分的(de)(de)嚴格，現代很多電子產(chan)(chan)品的(de)(de)貼(tie)(tie)片(pian)(pian)(pian)元器件尺寸(cun)正在(zai)(zai)(zai)趨(qu)于(yu)(yu)微(wei)小狀態，除了日(ri)(ri)漸微(wei)小精致的(de)(de)貼(tie)(tie)片(pian)(pian)(pian)元件產(chan)(chan)品，元器件對(dui)加(jia)工(gong)(gong)(gong)環境的(de)(de)要求(qiu)也日(ri)(ri)益苛刻，錫膏剛買回來，如(ru)果不馬上用，需放(fang)入冰(bing)箱里(li)進(jin)行冷藏，貼(tie)(tie)片(pian)(pian)(pian)加(jia)工(gong)(gong)(gong)價格，溫(wen)度(du)保持在(zai)(zai)(zai)5℃-0℃，不要低(di)于(yu)(yu)0℃。在(zai)(zai)(zai)貼(tie)(tie)裝(zhuang)工(gong)(gong)(gong)序，由(you)于(yu)(yu)貼(tie)(tie)片(pian)(pian)(pian)機設備的(de)(de)老化(hua)以及吸嘴(zui)、供料器的(de)(de)損(sun)壞(huai)，容易導致貼(tie)(tie)片(pian)(pian)(pian)機貼(tie)(tie)歪，沈陽貼(tie)(tie)片(pian)(pian)(pian)加(jia)工(gong)(gong)(gong)，并造(zao)成高拋(pao)料的(de)(de)發(fa)生(sheng)，降(jiang)低(di)生(sheng)產(chan)(chan)效率，貼(tie)(tie)片(pian)(pian)(pian)加(jia)工(gong)(gong)(gong)焊接，增加(jia)生(sheng)產(chan)(chan)成本。

SMT貼(tie)片(pian)的(de)(de)自(zi)動印(yin)刷機(ji)是(shi)(shi)(shi)什么(me)。其(qi)實就是(shi)(shi)(shi)在(zai)PCB板(ban)上(shang)(shang)(shang)的(de)(de)一些金(jin)手(shou)指上(shang)(shang)(shang)自(zi)動上(shang)(shang)(shang)錫膏，是(shi)(shi)(shi)錫膏自(zi)動刷上(shang)(shang)(shang)去的(de)(de)，目的(de)(de)是(shi)(shi)(shi)貼(tie)片(pian)前需要把錫膏準確的(de)(de)涂覆(fu)在(zai)焊盤上(shang)(shang)(shang)，否則(ze)將導致焊接不良（空焊，貼(tie)片(pian)加工廠(chang)家，立碑）。SMT貼(tie)片(pian)過程分  絲印(yin) ——點膠——貼(tie)裝——固化——回流焊接——清(qing)洗——檢(jian)測——返(fan)修(xiu)，上(shang)(shang)(shang)錫膏其(qi)實是(shi)(shi)(shi)使用自(zi)動印(yin)刷機(ji)進行上(shang)(shang)(shang)錫膏的(de)(de)，上(shang)(shang)(shang)錫膏需要有(you)(you)但是(shi)(shi)(shi)必需要有(you)(you)相(xiang)應的(de)(de)鋼網(wang)。