通(tong)孔(kong)焊點評(ping)估桌面參考手冊。除了(le)計(ji)算機生(sheng)成的3D圖(tu)形之外(wai)，還詳(xiang)細描述了(le)組(zu)件、孔(kong)壁和(he)(he)所需的焊接(jie)表面覆(fu)蓋范圍。覆(fu)蓋錫(xi)填(tian)充(chong)、接(jie)觸角(jiao)、浸(jin)錫(xi)、垂直填(tian)充(chong)、焊盤蓋和(he)(he)大量焊點缺(que)陷。模(mo)板設(she)計(ji)指(zhi)南(nan)。為(wei)焊膏和(he)(he)表面貼裝粘合劑涂層模(mo)板的設(she)計(ji)和(he)(he)制造提供指(zhi)導。我還討(tao)論了(le)使用表面貼裝技術的模(mo)板設(she)計(ji)，并介紹了(le)帶有通(tong)孔(kong)或倒裝芯(xin)片(pian)貼片(pian)貼片(pian)組(zu)件的窯爐。技術，包括(kuo)疊印(yin)、雙(shuang)印(yin)刷(shua)和(he)(he)分階(jie)段模(mo)板設(she)計(ji)。

隨著移(yi)動消費型(xing)電子產品對于小(xiao)型(xing)化，功(gong)能集成以及大存(cun)儲空間的(de)(de)(de)要(yao)求的(de)(de)(de)進一步提升，元器件(jian)(jian)的(de)(de)(de)小(xiao)型(xing)化高密(mi)度(du)(du)封裝(zhuang)(zhuang)(zhuang)形式也越來越多，PCB插(cha)件(jian)(jian)組裝(zhuang)(zhuang)(zhuang)廠商，如多模塊封裝(zhuang)(zhuang)(zhuang)(MCM)，系統封裝(zhuang)(zhuang)(zhuang)(SiP)，倒裝(zhuang)(zhuang)(zhuang)晶片(pian)等應用得越來越多。隨著小(xiao)型(xing)化高密(mi)度(du)(du)封裝(zhuang)(zhuang)(zhuang)的(de)(de)(de)出現，沈(shen)陽(yang)PCB插(cha)件(jian)(jian)組裝(zhuang)(zhuang)(zhuang)，對高速(su)與精度(du)(du)裝(zhuang)(zhuang)(zhuang)配的(de)(de)(de)要(yao)求變得更加(jia)關鍵(jian)。相關的(de)(de)(de)組裝(zhuang)(zhuang)(zhuang)設(she)備和(he)工(gong)(gong)藝也更具性與高靈(ling)活性。SMT加(jia)工(gong)(gong)工(gong)(gong)藝表面(mian)貼裝(zhuang)(zhuang)(zhuang)技術主(zhu)要(yao)包括 : 錫膏印刷、元件(jian)(jian)貼裝(zhuang)(zhuang)(zhuang)、回流焊接三個主(zhu)要(yao)生產工(gong)(gong)序。產品質量是(shi)所有(you)制造(zao)企業的(de)(de)(de)內(nei)容。

PCB在電(dian)(dian)(dian)子設備(bei)中具有如下功能(neng)。(1)提供(gong)(gong)集(ji)成電(dian)(dian)(dian)路(lu)等各種電(dian)(dian)(dian)子元(yuan)器(qi)(qi)件固定、裝配的機械支承，實(shi)現(xian)(xian)集(ji)成電(dian)(dian)(dian)路(lu)等各種電(dian)(dian)(dian)子元(yuan)器(qi)(qi)件之(zhi)間的布線(xian)和電(dian)(dian)(dian)氣連(lian)接或電(dian)(dian)(dian)絕緣，提供(gong)(gong)所(suo)要求的電(dian)(dian)(dian)氣特(te)性(xing)。(2)為(wei)自動(dong)焊接提供(gong)(gong)阻焊圖形(xing)(xing)，為(wei)元(yuan)器(qi)(qi)件插(cha)裝、檢查、維(wei)修(xiu)提供(gong)(gong)識(shi)別(bie)字符和圖形(xing)(xing)。(3)電(dian)(dian)(dian)子設備(bei)采用印制(zhi)板(ban)(ban)后，PCB插(cha)件組裝價(jia)格(ge)，由于同類印制(zhi)板(ban)(ban)的一致性(xing)，避免了(le)人工接線(xian)的差(cha)錯，PCB插(cha)件組裝加工，并(bing)可(ke)實(shi)現(xian)(xian)電(dian)(dian)(dian)子元(yuan)器(qi)(qi)件自動(dong)插(cha)裝或貼裝、自動(dong)焊錫、自動(dong)檢測，保(bao)證了(le)電(dian)(dian)(dian)子產(chan)(chan)品的質(zhi)量(liang)，提高了(le)勞動(dong)生產(chan)(chan)率、降低(di)了(le)成本，并(bing)便于維(wei)修(xiu)。