SMT貼片(pian)加(jia)工(gong)(gong)(gong)（SMT），沈(shen)陽smt貼片(pian)加(jia)工(gong)(gong)(gong)，是一種電(dian)(dian)子(zi)(zi)裝(zhuang)聯技術(shu)，起(qi)源于20世(shi)紀(ji)80年(nian)代，沈(shen)陽smt貼片(pian)，是將(jiang)電(dian)(dian)子(zi)(zi)元件，如電(dian)(dian)阻、電(dian)(dian)容、晶體管(guan)、集成電(dian)(dian)路(lu)(lu)等(deng)等(deng)安(an)裝(zhuang)到印刷電(dian)(dian)路(lu)(lu)板(ban)(ban)上(shang)，沈(shen)陽smt貼片(pian)價格(ge)，并通過釬焊形成電(dian)(dian)氣聯結(jie)。SMT貼片(pian)加(jia)工(gong)(gong)(gong)是指在PCB裸板(ban)(ban)上(shang)將(jiang)電(dian)(dian)子(zi)(zi)元器件等(deng)物料貼裝(zhuang)在上(shang)面的(de)過程。它是目前電(dian)(dian)子(zi)(zi)組裝(zhuang)行(xing)業較為流行(xing)的(de)的(de)加(jia)工(gong)(gong)(gong)技術(shu)。SMT貼片(pian)加(jia)工(gong)(gong)(gong)流程由(you)多道工(gong)(gong)(gong)藝組成，其制程中的(de)工(gong)(gong)(gong)藝控制決(jue)定加(jia)工(gong)(gong)(gong)成品(pin)質(zhi)量。

點(dian)膠又可(ke)以分為(wei)手動(dong)點(dian)膠或(huo)自動(dong)點(dian)膠，根據工藝需要進行確認； SMT貼片(pian)元(yuan)器件(jian)(jian)體積(ji)特別(bie)小，重量輕，貼片(pian)元(yuan)件(jian)(jian)比引線元(yuan)件(jian)(jian)容易焊接。貼片(pian)元(yuan)件(jian)(jian)還有一個很重要的(de)(de)(de)好處，沈(shen)陽smt貼片(pian)廠，那就(jiu)是提高了(le)電(dian)(dian)路的(de)(de)(de)穩定性和(he)可(ke)靠性，對于制作來說就(jiu)是提高了(le)制作的(de)(de)(de)成功率(lv)。SMT組裝(zhuang)前的(de)(de)(de)檢驗：組裝(zhuang)前檢驗(來料(liao)檢驗)是保證表(biao)面組裝(zhuang)質量的(de)(de)(de)首(shou)要條件(jian)(jian)，元(yuan)器件(jian)(jian)、印制電(dian)(dian)路板、表(biao)面組裝(zhuang)材料(liao)的(de)(de)(de)質量直(zhi)接影響表(biao)面組裝(zhuang)板的(de)(de)(de)組裝(zhuang)質量。

功能：回流焊(han)(han)(han)(han)機主要用(yong)于(yu)各(ge)類表(biao)面(mian)(mian)組裝(zhuang)(zhuang)的(de)元(yuan)器(qi)件(jian)(jian)的(de)焊(han)(han)(han)(han)接，其(qi)作用(yong)是通過重(zhong)新熔化預先分配(pei)到(dao)印(yin)制(zhi)板(ban)(ban)焊(han)(han)(han)(han)盤上(shang)的(de)膏(gao)狀(zhuang)軟(ruan)釬焊(han)(han)(han)(han)料，實現表(biao)面(mian)(mian)組裝(zhuang)(zhuang)元(yuan)器(qi)件(jian)(jian)焊(han)(han)(han)(han)端或(huo)引腳與印(yin)制(zhi)板(ban)(ban)焊(han)(han)(han)(han)盤之間機械與電氣連接。表(biao)面(mian)(mian)安(an)裝(zhuang)(zhuang)元(yuan)器(qi)件(jian)(jian)在(zai)功能上(shang)和(he)插裝(zhuang)(zhuang)元(yuan)器(qi)件(jian)(jian)沒有差別(bie)，其(qi)不(bu)同(tong)之處在(zai)于(yu)元(yuan)器(qi)件(jian)(jian)的(de)封裝(zhuang)(zhuang)。表(biao)面(mian)(mian)安(an)裝(zhuang)(zhuang)的(de)封裝(zhuang)(zhuang)在(zai)焊(han)(han)(han)(han)接時要經受奶(nai)高的(de)溫度其(qi)元(yuan)器(qi)件(jian)(jian)和(he)基板(ban)(ban)必須(xu)具有匹配(pei)的(de)熱膨(peng)脹(zhang)系(xi)數。這些因素(su)在(zai)產品設計中必須(xu)全盤考慮。