熱(re)壓(ya)焊(han)利用加(jia)(jia)熱(re)和加(jia)(jia)壓(ya)力(li)(li)使金屬絲與焊(han)區壓(ya)焊(han)在一起。其原(yuan)理(li)是通過加(jia)(jia)熱(re)和加(jia)(jia)壓(ya)力(li)(li)，使焊(han)區（如AI）發生(sheng)塑性形(xing)變同時破壞壓(ya)焊(han)界(jie)面上的(de)氧(yang)化層(ceng)，從而使原(yuan)子間產生(sheng)吸引力(li)(li)達到“鍵合”的(de)目的(de)，PCBA測(ce)試(shi)(shi)也包(bao)含5種主要(yao)形(xing)式(shi)：ICT測(ce)試(shi)(shi)、FCT測(ce)試(shi)(shi)、老(lao)化測(ce)試(shi)(shi)、疲勞測(ce)試(shi)(shi)、惡(e)劣(lie)環境下的(de)測(ce)試(shi)(shi)。經過必要(yao)的(de)IPQC中檢，沈(shen)陽smt貼片(pian)加(jia)(jia)工(gong)廠，隨即就可以使用DIP插件工(gong)藝將插件物料穿過電路板，然后流經波峰焊(han)進行焊(han)接(jie)。

高度重視制程(cheng)(cheng)與過(guo)程(cheng)(cheng)，沈陽smt貼(tie)(tie)(tie)片(pian)(pian)(pian)加工(gong)價格，一(yi)次就做(zuo)好。嚴格按照標(biao)準作(zuo)業，沈陽smt貼(tie)(tie)(tie)片(pian)(pian)(pian)加工(gong)報(bao)價，各種潛在(zai)(zai)質(zhi)(zhi)量隱患。在(zai)(zai)乎任何小小質(zhi)(zhi)量問(wen)題(ti)，有問(wen)題(ti)需(xu)立即反饋改善。任何質(zhi)(zhi)量問(wen)題(ti)都(dou)需(xu)找(zhao)到(dao)根源，沈陽smt貼(tie)(tie)(tie)片(pian)(pian)(pian)加工(gong)，目視是(shi)無法cover所有質(zhi)(zhi)量問(wen)題(ti)。SMT貼(tie)(tie)(tie)片(pian)(pian)(pian)加工(gong)的(de)主要(yao)目的(de)是(shi)將表面(mian)組裝(zhuang)元器件準確安裝(zhuang)到(dao)PCB的(de)固定(ding)位置上(shang)，而在(zai)(zai)貼(tie)(tie)(tie)片(pian)(pian)(pian)加工(gong)過(guo)程(cheng)(cheng)中(zhong)有時會出現(xian)一(yi)些工(gong)藝(yi)問(wen)題(ti)，影響貼(tie)(tie)(tie)片(pian)(pian)(pian)質(zhi)(zhi)量，如元器件的(de)移位。SMT貼(tie)(tie)(tie)片(pian)(pian)(pian)膠拉絲主要(yao)受(shou)其主成份樹脂拉絲性(xing)的(de)影響和對(dui)點涂條(tiao)件的(de)設(she)定(ding)。

維(wei)修(xiu)時，不能僅僅憑(ping)仗電(dian)(dian)(dian)感量來交換貼(tie)(tie)片(pian)電(dian)(dian)(dian)感。還要曉得(de)貼(tie)(tie)片(pian)電(dian)(dian)(dian)感的(de)任務頻段，才干保證任務功能。貼(tie)(tie)片(pian)電(dian)(dian)(dian)感的(de)外形、尺寸(cun)根本類似，外形上也沒有分明標(biao)志。在焊(han)(han)接(jie)(jie)前(qian)，需要了解清楚元器件(jian)是(shi)否有特別要求，如焊(han)(han)接(jie)(jie)溫度條件(jian)，裝配方式(shi)等。有些(xie)元器件(jian)不能用(yong)(yong)浸錫(xi)方法，只能用(yong)(yong)電(dian)(dian)(dian)烙鐵焊(han)(han)接(jie)(jie)，例(li)如片(pian)狀電(dian)(dian)(dian)位(wei)器和鋁電(dian)(dian)(dian)解電(dian)(dian)(dian)容(rong)，所以就需要根據情況選擇正確的(de)焊(han)(han)接(jie)(jie)方式(shi)。