刨(bao)花板(ban)(ban)(ban)(ban)的(de)(de)生(sheng)產(chan)方(fang)法(fa)(fa)按(an)其板(ban)(ban)(ban)(ban)坯成型及熱壓(ya)(ya)工(gong)藝設備不同，分為(wei)(wei)間(jian)歇性(xing)(xing)生(sheng)產(chan)的(de)(de)平壓(ya)(ya)法(fa)(fa)和(he)連續性(xing)(xing)生(sheng)產(chan)的(de)(de)擠壓(ya)(ya)法(fa)(fa)、輥壓(ya)(ya)法(fa)(fa)。實際生(sheng)產(chan)中以(yi)用平壓(ya)(ya)法(fa)(fa)為(wei)(wei)主。熱壓(ya)(ya)是刨(bao)花板(ban)(ban)(ban)(ban)生(sheng)產(chan)一個(ge)關鍵性(xing)(xing)工(gong)序，天(tian)津(jin)OSB刨(bao)花板(ban)(ban)(ban)(ban)，所起作(zuo)用是使板(ban)(ban)(ban)(ban)坯中膠料固化，osb刨(bao)花板(ban)(ban)(ban)(ban)原(yuan)料，并將松(song)散的(de)(de)板(ban)(ban)(ban)(ban)坯經加壓(ya)(ya)后(hou)固結成規定厚度(du)(du)的(de)(de)板(ban)(ban)(ban)(ban)材。其工(gong)藝要求為(wei)(wei)：適當的(de)(de)含(han)(han)水(shui)率(lv)(lv)。表(biao)層(ceng)含(han)(han)水(shui)率(lv)(lv)為(wei)(wei)18～20%時有利于(yu)(yu)抗彎強度(du)(du)、抗拉(la)強度(du)(du)和(he)表(biao)面(mian)光潔(jie)度(du)(du)的(de)(de)提高，減少卸壓(ya)(ya)時板(ban)(ban)(ban)(ban)坯鼓泡分層(ceng)的(de)(de)可能。芯層(ceng)含(han)(han)水(shui)率(lv)(lv)應(ying)適當低于(yu)(yu)表(biao)層(ceng)，以(yi)保(bao)持適當的(de)(de)平面(mian)抗拉(la)強度(du)(du)。

尋求資源豐(feng)富、價格低廉的膠(jiao)粘(zhan)(zhan)劑是發(fa)(fa)展(zhan)刨(bao)花(hua)板(ban)(ban)生(sheng)產重要因素，因此林產資源和造紙(zhi)制漿(jiang)廢液的有效(xiao)利用(yong)已越來越受到重視。單寧(ning)甲醛膠(jiao)及亞硫酸鹽紙(zhi)漿(jiang)廢液膠(jiao)用(yong)作(zuo)膠(jiao)粘(zhan)(zhan)劑已取得(de)成(cheng)功(gong)，水泥、石膏(gao)等制成(cheng)的無機膠(jiao)粘(zhan)(zhan)劑也已得(de)到應用(yong)；而更(geng)具吸引(yin)力(li)的是無膠(jiao)粘(zhan)(zhan)合(he)新(xin)技(ji)術，OSB刨(bao)花(hua)板(ban)(ban)報價，它的出現(xian)將使(shi)刨(bao)花(hua)板(ban)(ban)工(gong)(gong)業發(fa)(fa)生(sheng)根本性(xing)變(bian)革。至于刨(bao)花(hua)板(ban)(ban)本身，由于定向型結構(gou)在力(li)學性(xing)能方(fang)面(mian)顯(xian)著優于隨機型結構(gou)，可以(yi)用(yong)來代替(ti)膠(jiao)合(he)板(ban)(ban)甚至部分(fen)鋸制板(ban)(ban)材(cai)，故(gu)大有發(fa)(fa)展(zhan)前途。刨(bao)花(hua)板(ban)(ban)表面(mian)裝飾(shi)加工(gong)(gong)也將出現(xian)更(geng)多(duo)(duo)的新(xin)材(cai)料和新(xin)工(gong)(gong)藝，并(bing)有可能通過多(duo)(duo)品種(zhong)多(duo)(duo)功(gong)能飾(shi)面(mian)材(cai)料預制的化，形成(cheng)一個(ge)獨立(li)的新(xin)興工(gong)(gong)業門(men)類。

隨著VLSI、電(dian)子零件的(de)(de)(de)小(xiao)型(xing)化、高(gao)集積(ji)化的(de)(de)(de)進(jin)展，多(duo)層(ceng)板(ban)(ban)多(duo)朝搭配高(gao)功能電(dian)路(lu)的(de)(de)(de)方向前進(jin)，是故對高(gao)密(mi)(mi)度(du)線(xian)路(lu)、高(gao)布線(xian)容量的(de)(de)(de)需求(qiu)(qiu)日殷，也連帶地(di)對電(dian)氣(qi)特性（如(ru)Crosstalk、阻抗特性的(de)(de)(de)整(zheng)合(he)）的(de)(de)(de)要求(qiu)(qiu)更(geng)(geng)趨嚴(yan)格(ge)。而多(duo)腳(jiao)數零件、表面組裝元(yuan)件（SMD）的(de)(de)(de)盛行(xing)，使得電(dian)路(lu)板(ban)(ban)線(xian)路(lu)圖(tu)案的(de)(de)(de)形(xing)(xing)狀更(geng)(geng)復雜(za)、導(dao)體線(xian)路(lu)及(ji)(ji)孔(kong)(kong)徑(jing)更(geng)(geng)細小(xiao)，且朝高(gao)多(duo)層(ceng)板(ban)(ban)（10~15層(ceng)）的(de)(de)(de)開發蔚(yu)為(wei)(wei)風氣(qi)。1980年代后半，為(wei)(wei)符合(he)小(xiao)型(xing)、輕量化需求(qiu)(qiu)的(de)(de)(de)高(gao)密(mi)(mi)度(du)布線(xian)、小(xiao)孔(kong)(kong)走(zou)勢，0.4~0.6 mm厚的(de)(de)(de)薄形(xing)(xing)多(duo)層(ceng)板(ban)(ban)則逐(zhu)漸普及(ji)(ji)。以沖孔(kong)(kong)加(jia)工方式完成(cheng)零件導(dao)孔(kong)(kong)及(ji)(ji)外形(xing)(xing)。此外，部份(fen)少(shao)量多(duo)樣生產的(de)(de)(de)產品，則采用感光阻劑(ji)形(xing)(xing)成(cheng)圖(tu)樣的(de)(de)(de)照相法。