等離(li)子(zi)(zi)電(dian)漿拋(pao)(pao)(pao)光(guang)機(ji)是一種基于(yu)低溫(wen)等離(li)子(zi)(zi)體(ti)(ti)技(ji)術的(de)(de)精(jing)密(mi)表面(mian)(mian)(mian)(mian)處理(li)(li)設備，通過電(dian)離(li)氣(qi)體(ti)(ti)產生的(de)(de)活性(xing)(xing)粒(li)子(zi)(zi)實(shi)現材(cai)(cai)料(liao)表面(mian)(mian)(mian)(mian)的(de)(de)超(chao)精(jing)細(xi)加工(gong)。其(qi)原(yuan)理(li)(li)是在真空環(huan)境下，利用高頻電(dian)場(chang)將(jiang)惰性(xing)(xing)氣(qi)體(ti)(ti)（如氣(qi)）電(dian)離(li)為等離(li)子(zi)(zi)態，形(xing)成高能(neng)電(dian)子(zi)(zi)、離(li)子(zi)(zi)和(he)自由(you)基的(de)(de)混合(he)體(ti)(ti)。這些高活性(xing)(xing)粒(li)子(zi)(zi)以物理(li)(li)轟擊(ji)與(yu)化學蝕刻(ke)協同作(zuo)用，逐(zhu)層剝離(li)材(cai)(cai)料(liao)表面(mian)(mian)(mian)(mian)納米級(ji)凸起，達到原(yuan)子(zi)(zi)級(ji)平整效果。工(gong)藝(yi)流(liu)程分為四個階段：首(shou)行預處理(li)(li)，通過超(chao)聲波清洗去除工(gong)件表面(mian)(mian)(mian)(mian)油脂與(yu)顆粒(li)；隨(sui)后(hou)在真空腔體(ti)(ti)內通入(ru)(ru)工(gong)藝(yi)氣(qi)體(ti)(ti)，施加射頻電(dian)源激發(fa)穩(wen)定等離(li)子(zi)(zi)體(ti)(ti)；接(jie)(jie)著通過控(kong)制氣(qi)體(ti)(ti)流(liu)量、功率及(ji)處理(li)(li)時(shi)間（通常為5-30分鐘），實(shi)現0.1-1μm的(de)(de)材(cai)(cai)料(liao)去除量；進行惰性(xing)(xing)氣(qi)體(ti)(ti)保護冷(leng)卻，避免二次氧化。關鍵(jian)參數(shu)包括工(gong)作(zuo)壓力（10-100Pa）、射頻頻率（13.56MHz或2.45GHz）及(ji)溫(wen)度(du)控(kong)制（50-200℃）。該技(ji)術主要應用于(yu)航(hang)空航(hang)天精(jing)密(mi)部件、半導體(ti)(ti)晶(jing)圓、植(zhi)入(ru)(ru)體(ti)(ti)及(ji)光(guang)學鏡片(pian)等領(ling)域，尤其(qi)擅(shan)長處理(li)(li)不銹鋼、鈦合(he)金等難加工(gong)材(cai)(cai)料(liao)。相較(jiao)于(yu)傳統拋(pao)(pao)(pao)光(guang)，鋅合(he)金等離(li)子(zi)(zi)拋(pao)(pao)(pao)光(guang)設備，其(qi)優勢顯著：非(fei)接(jie)(jie)觸式加工(gong)消除機(ji)械應力，可處理(li)(li)復雜微結(jie)構；表面(mian)(mian)(mian)(mian)粗(cu)糙度(du)可達Ra≤0.01μm，且無(wu)化學殘留(liu)；能(neng)耗降低40%以上，廢棄物排放減少90%。隨(sui)著5G精(jing)密(mi)零部件和(he)微型需求增長，等離(li)子(zi)(zi)拋(pao)(pao)(pao)光(guang)正逐(zhu)步成為制造領(ling)域的(de)(de)關鍵(jian)表面(mian)(mian)(mian)(mian)處理(li)(li)技(ji)術。

等(deng)(deng)(deng)離(li)(li)子(zi)電漿(jiang)拋光(guang)(guang)(guang)機(ji)(ji)工(gong)(gong)(gong)(gong)(gong)藝是一種的(de)(de)(de)(de)(de)金屬表面處(chu)理(li)技術，它利用高(gao)(gao)溫(wen)高(gao)(gao)壓下形(xing)成的(de)(de)(de)(de)(de)等(deng)(deng)(deng)離(li)(li)子(zi)體對工(gong)(gong)(gong)(gong)(gong)件(jian)進(jin)行(xing)拋光(guang)(guang)(guang)。等(deng)(deng)(deng)離(li)(li)子(zi)體是由電子(zi)脫離(li)(li)原子(zi)核后形(xing)成的(de)(de)(de)(de)(de)高(gao)(gao)能(neng)(neng)量狀態(tai)(tai)的(de)(de)(de)(de)(de)物(wu)質(zhi)第四態(tai)(tai)，等(deng)(deng)(deng)離(li)(li)子(zi)拋光(guang)(guang)(guang)設備工(gong)(gong)(gong)(gong)(gong)廠，當(dang)這些帶正(zheng)電的(de)(de)(de)(de)(de)離(li)(li)子(zi)與待(dai)拋光(guang)(guang)(guang)的(de)(de)(de)(de)(de)物(wu)體摩擦時(shi)(shi)，能(neng)(neng)夠(gou)迅速使物(wu)體表面達到光(guang)(guang)(guang)亮效果(guo)。該工(gong)(gong)(gong)(gong)(gong)藝的(de)(de)(de)(de)(de)操作(zuo)(zuo)(zuo)流(liu)程(cheng)通常包括上(shang)掛、上(shang)架、將工(gong)(gong)(gong)(gong)(gong)件(jian)放(fang)入電解(jie)液缸中進(jin)行(xing)的(de)(de)(de)(de)(de)電漿(jiang)拋光(guang)(guang)(guang)處(chu)理(li)（同時(shi)(shi)旋轉180度(du)(du)）、下架清洗以及(ji)(ji)烘烤和(he)(he)下架工(gong)(gong)(gong)(gong)(gong)序等(deng)(deng)(deng)多個步驟(zou)；操作(zuo)(zuo)(zuo)溫(wen)度(du)(du)和(he)(he)工(gong)(gong)(gong)(gong)(gong)作(zuo)(zuo)(zuo)時(shi)(shi)長也均有(you)明確標準(zhun)——如工(gong)(gong)(gong)(gong)(gong)作(zuo)(zuo)(zuo)溫(wen)度(du)(du)為(wei)70﹨~100℃，工(gong)(gong)(gong)(gong)(gong)作(zuo)(zuo)(zuo)時(shi)(shi)間為(wei)30﹨~180秒等(deng)(deng)(deng)等(deng)(deng)(deng)以確保的(de)(de)(de)(de)(de)拋光(guang)(guang)(guang)質(zhi)量和(he)(he)效率。。相比(bi)傳(chuan)統的(de)(de)(de)(de)(de)手工(gong)(gong)(gong)(gong)(gong)或機(ji)(ji)械拋光(guang)(guang)(guang)方法而言：它能(neng)(neng)有(you)效去(qu)除沖壓件(jian)或其他(ta)制造(zao)件(jian)的(de)(de)(de)(de)(de)邊角(jiao)(jiao)毛刺及(ji)(ji)表面缺陷污染物(wu)的(de)(de)(de)(de)(de)同時(shi)(shi)產(chan)生一層鈍化膜(mo)以增(zeng)強抗腐蝕性能(neng)(neng)；其均勻(yun)程(cheng)度(du)(du)，可使整個工(gong)(gong)(gong)(gong)(gong)件(jian)表甚(shen)至所有(you)死(si)角(jiao)(jiao)部位都能(neng)(neng)呈現(xian)出(chu)一致的(de)(de)(de)(de)(de)近鏡面效果(guo)。此外還具(ju)有(you)生產(chan)、成本低且不造(zao)成化學(xue)污染等(deng)(deng)(deng)優勢特點——采用自(zi)動化控(kong)制使得操作(zuo)(zuo)(zuo)簡單維(wei)護方便(bian)且能(neng)(neng)大幅減少作(zuo)(zuo)(zuo)業人(ren)員降低人(ren)工(gong)(gong)(gong)(gong)(gong)成本同時(shi)(shi)還可節省因人(ren)工(gong)(gong)(gong)(gong)(gong)等(deng)(deng)(deng)傳(chuan)統方式(shi)而造(zao)成的(de)(de)(de)(de)(de)許多材料消耗并有(you)利于后續的(de)(de)(de)(de)(de)真空鍍膜(mo)前(qian)處(chu)理(li)等(deng)(deng)(deng)工(gong)(gong)(gong)(gong)(gong)藝流(liu)程(cheng)的(de)(de)(de)(de)(de)展開與應(ying)用推(tui)廣(guang)范圍的(de)(de)(de)(de)(de)不斷(duan)擴(kuo)大至手機(ji)(ji)數(shu)碼(ma)集(ji)成電路運動器(qi)材航空航天等(deng)(deng)(deng)諸多領域(yu)之中發揮著(zhu)愈加重要的(de)(de)(de)(de)(de)作(zuo)(zuo)(zuo)用和(he)(he)影(ying)響力

等(deng)(deng)離(li)子(zi)(zi)拋(pao)(pao)光(guang)(guang)（PlasmaPolishing）是一種基于低(di)溫等(deng)(deng)離(li)子(zi)(zi)體(ti)(ti)(ti)技(ji)術的(de)(de)(de)(de)精(jing)密表(biao)(biao)面(mian)(mian)(mian)處(chu)理工(gong)(gong)藝(yi)，其(qi)原(yuan)(yuan)理是利用(yong)電離(li)氣體(ti)(ti)(ti)產(chan)生的(de)(de)(de)(de)活性(xing)(xing)(xing)粒子(zi)(zi)對材料表(biao)(biao)面(mian)(mian)(mian)進(jin)行原(yuan)(yuan)子(zi)(zi)級(ji)去除(chu)，實現亞微米級(ji)精(jing)度(du)的(de)(de)(de)(de)超光(guang)(guang)滑表(biao)(biao)面(mian)(mian)(mian)加(jia)工(gong)(gong)。與傳(chuan)統機(ji)械或(huo)化學(xue)拋(pao)(pao)光(guang)(guang)相比，等(deng)(deng)離(li)子(zi)(zi)拋(pao)(pao)光(guang)(guang)設(she)備(bei)，該(gai)技(ji)術通過控制等(deng)(deng)離(li)子(zi)(zi)體(ti)(ti)(ti)中的(de)(de)(de)(de)高能(neng)粒子(zi)(zi)（如電子(zi)(zi)、離(li)子(zi)(zi)、自由基）與工(gong)(gong)件表(biao)(biao)面(mian)(mian)(mian)的(de)(de)(de)(de)物理轟(hong)擊和化學(xue)反應(ying)，可(ke)在(zai)(zai)不改變材料基體(ti)(ti)(ti)性(xing)(xing)(xing)能(neng)的(de)(de)(de)(de)前(qian)(qian)提下，有(you)效(xiao)消除(chu)表(biao)(biao)面(mian)(mian)(mian)微觀(guan)缺陷。在(zai)(zai)真空或(huo)低(di)壓(ya)環境中，工(gong)(gong)作氣體(ti)(ti)(ti)（常用(yong)氣、氧氣或(huo)混合氣體(ti)(ti)(ti)）經高頻電場電離(li)形(xing)成等(deng)(deng)離(li)子(zi)(zi)體(ti)(ti)(ti)，其(qi)中帶電粒子(zi)(zi)以定向(xiang)動能(neng)撞擊工(gong)(gong)件表(biao)(biao)面(mian)(mian)(mian)，選(xuan)擇性(xing)(xing)(xing)去除(chu)凸起部(bu)位(wei)的(de)(de)(de)(de)原(yuan)(yuan)子(zi)(zi)層。這種非接觸式(shi)加(jia)工(gong)(gong)方式(shi)特別(bie)適用(yong)于復雜幾(ji)何結(jie)構（如微孔(kong)、內(nei)腔、異形(xing)曲(qu)面(mian)(mian)(mian)）的(de)(de)(de)(de)拋(pao)(pao)光(guang)(guang)，處(chu)理精(jing)度(du)可(ke)達Ra0.01μm，且(qie)能(neng)保(bao)(bao)持工(gong)(gong)件原(yuan)(yuan)有(you)尺寸精(jing)度(du)。目前(qian)(qian)該(gai)技(ji)術已在(zai)(zai)航空航天(tian)發動機(ji)葉(xie)片、（如人工(gong)(gong)關節）、光(guang)(guang)學(xue)鏡片及(ji)半導(dao)體(ti)(ti)(ti)晶圓等(deng)(deng)制造(zao)(zao)領域(yu)獲得應(ying)用(yong)。等(deng)(deng)離(li)子(zi)(zi)拋(pao)(pao)光(guang)(guang)的(de)(de)(de)(de)優勢體(ti)(ti)(ti)現在(zai)(zai)環保(bao)(bao)性(xing)(xing)(xing)和普適性(xing)(xing)(xing)：處(chu)理過程無需化學(xue)拋(pao)(pao)光(guang)(guang)液(ye)，廢棄物接近零排放，符合綠色制造(zao)(zao)標準；可(ke)處(chu)理不銹鋼、鈦合金、陶瓷等(deng)(deng)多種材料，尤其(qi)擅長處(chu)理傳(chuan)統方法易導(dao)致變形(xing)的(de)(de)(de)(de)超薄(bo)件（厚(hou)度(du)0.1mm）。盡管設(she)備(bei)初(chu)期投資(zi)較(jiao)高（單(dan)臺設(she)備(bei)約200-500萬元），等(deng)(deng)離(li)子(zi)(zi)拋(pao)(pao)光(guang)(guang)設(she)備(bei)廠家，但其(qi)加(jia)工(gong)(gong)效(xiao)率較(jiao)傳(chuan)統工(gong)(gong)藝(yi)提升(sheng)3-5倍，且(qie)能(neng)顯著(zhu)延(yan)長工(gong)(gong)件疲勞壽命。隨著(zhu)精(jing)密制造(zao)(zao)向(xiang)納米級(ji)精(jing)度(du)發展，等(deng)(deng)離(li)子(zi)(zi)拋(pao)(pao)光(guang)(guang)與智能(neng)控制系統、原(yuan)(yuan)位(wei)檢測技(ji)術的(de)(de)(de)(de)融合，正推動該(gai)技(ji)術向(xiang)智能(neng)化、模塊化方向(xiang)演進(jin)，成為裝備(bei)制造(zao)(zao)的(de)(de)(de)(de)革(ge)新性(xing)(xing)(xing)表(biao)(biao)面(mian)(mian)(mian)處(chu)理方案。