隨(sui)著(zhu)電子(zi)(zi)制造技(ji)(ji)術(shu)的(de)(de)不(bu)斷發展(zhan)，表(biao)面(mian)貼(tie)裝(zhuang)(zhuang)技(ji)(ji)術(shu)（SMT）加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)與傳統(tong)(tong)插(cha)件(jian)工(gong)(gong)(gong)(gong)(gong)(gong)藝(yi)(yi)成為了電子(zi)(zi)組裝(zhuang)(zhuang)領域(yu)的(de)(de)兩大(da)(da)主流(liu)工(gong)(gong)(gong)(gong)(gong)(gong)藝(yi)(yi)。這兩種工(gong)(gong)(gong)(gong)(gong)(gong)藝(yi)(yi)各有(you)特(te)(te)點，下(xia)面(mian)將從(cong)幾個方面(mian)對(dui)它們進行詳細對(dui)比。1.生(sheng)(sheng)(sheng)產(chan)(chan)(chan)(chan)(chan)效(xiao)率(lv)SMT加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)采用(yong)(yong)自動化生(sheng)(sheng)(sheng)產(chan)(chan)(chan)(chan)(chan)線，通過(guo)高(gao)(gao)(gao)(gao)(gao)精度的(de)(de)貼(tie)片(pian)機將元器(qi)(qi)件(jian)快速、準確地(di)貼(tie)裝(zhuang)(zhuang)到(dao)PCB板上(shang)，大(da)(da)大(da)(da)提(ti)(ti)高(gao)(gao)(gao)(gao)(gao)了生(sheng)(sheng)(sheng)產(chan)(chan)(chan)(chan)(chan)效(xiao)率(lv)。相比之下(xia)，傳統(tong)(tong)插(cha)件(jian)工(gong)(gong)(gong)(gong)(gong)(gong)藝(yi)(yi)需(xu)要人(ren)工(gong)(gong)(gong)(gong)(gong)(gong)插(cha)裝(zhuang)(zhuang)元器(qi)(qi)件(jian)，生(sheng)(sheng)(sheng)產(chan)(chan)(chan)(chan)(chan)效(xiao)率(lv)較低。2.產(chan)(chan)(chan)(chan)(chan)品(pin)(pin)質(zhi)量(liang)(liang)SMT加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)采用(yong)(yong)精密(mi)的(de)(de)設(she)備(bei)和(he)工(gong)(gong)(gong)(gong)(gong)(gong)藝(yi)(yi)，經驗豐富PCBA加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)代工(gong)(gong)(gong)(gong)(gong)(gong)工(gong)(gong)(gong)(gong)(gong)(gong)廠(chang)，能(neng)夠實現更(geng)(geng)(geng)小(xiao)的(de)(de)元器(qi)(qi)件(jian)尺寸(cun)和(he)更(geng)(geng)(geng)高(gao)(gao)(gao)(gao)(gao)的(de)(de)貼(tie)裝(zhuang)(zhuang)精度，PCBA加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)代工(gong)(gong)(gong)(gong)(gong)(gong)工(gong)(gong)(gong)(gong)(gong)(gong)廠(chang)，從(cong)而提(ti)(ti)高(gao)(gao)(gao)(gao)(gao)了產(chan)(chan)(chan)(chan)(chan)品(pin)(pin)的(de)(de)質(zhi)量(liang)(liang)和(he)可靠性。而傳統(tong)(tong)插(cha)件(jian)工(gong)(gong)(gong)(gong)(gong)(gong)藝(yi)(yi)由于人(ren)為因素的(de)(de)影響較大(da)(da)，產(chan)(chan)(chan)(chan)(chan)品(pin)(pin)質(zhi)量(liang)(liang)和(he)穩(wen)定性相對(dui)較差。3.生(sheng)(sheng)(sheng)產(chan)(chan)(chan)(chan)(chan)成本(ben)雖然(ran)SMT加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)設(she)備(bei)的(de)(de)初期投入較高(gao)(gao)(gao)(gao)(gao)，但由于其生(sheng)(sheng)(sheng)產(chan)(chan)(chan)(chan)(chan)、產(chan)(chan)(chan)(chan)(chan)品(pin)(pin)質(zhi)量(liang)(liang)穩(wen)定，前(qian)沿PCBA加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)代工(gong)(gong)(gong)(gong)(gong)(gong)工(gong)(gong)(gong)(gong)(gong)(gong)廠(chang)，長期來(lai)看，SMT加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)的(de)(de)生(sheng)(sheng)(sheng)產(chan)(chan)(chan)(chan)(chan)成本(ben)相對(dui)較低。而傳統(tong)(tong)插(cha)件(jian)工(gong)(gong)(gong)(gong)(gong)(gong)藝(yi)(yi)雖然(ran)設(she)備(bei)投入較少，但由于生(sheng)(sheng)(sheng)產(chan)(chan)(chan)(chan)(chan)效(xiao)率(lv)低、產(chan)(chan)(chan)(chan)(chan)品(pin)(pin)質(zhi)量(liang)(liang)不(bu)穩(wen)定，可能(neng)需(xu)要更(geng)(geng)(geng)多(duo)的(de)(de)返(fan)工(gong)(gong)(gong)(gong)(gong)(gong)和(he)維修，導致(zhi)生(sheng)(sheng)(sheng)產(chan)(chan)(chan)(chan)(chan)成本(ben)相對(dui)較高(gao)(gao)(gao)(gao)(gao)。4.適(shi)用(yong)(yong)范圍(wei)SMT加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)適(shi)用(yong)(yong)于大(da)(da)規(gui)模、高(gao)(gao)(gao)(gao)(gao)密(mi)度的(de)(de)電子(zi)(zi)組裝(zhuang)(zhuang)，特(te)(te)別適(shi)用(yong)(yong)于消費電子(zi)(zi)產(chan)(chan)(chan)(chan)(chan)品(pin)(pin)、通信設(she)備(bei)等領域(yu)。而傳統(tong)(tong)插(cha)件(jian)工(gong)(gong)(gong)(gong)(gong)(gong)藝(yi)(yi)則更(geng)(geng)(geng)適(shi)用(yong)(yong)于一些特(te)(te)殊元器(qi)(qi)件(jian)、大(da)(da)尺寸(cun)元器(qi)(qi)件(jian)或(huo)需(xu)要特(te)(te)殊處理的(de)(de)場合。SMT加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)與傳統(tong)(tong)插(cha)件(jian)工(gong)(gong)(gong)(gong)(gong)(gong)藝(yi)(yi)在多(duo)個方面(mian)存在明顯(xian)差異。隨(sui)著(zhu)電子(zi)(zi)制造業(ye)的(de)(de)不(bu)斷發展(zhan)和(he)技(ji)(ji)術(shu)創新(xin)的(de)(de)推動，SMT加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)將逐(zhu)漸成為主流(liu)工(gong)(gong)(gong)(gong)(gong)(gong)藝(yi)(yi)，為電子(zi)(zi)制造業(ye)的(de)(de)可持續發展(zhan)注入新(xin)的(de)(de)活(huo)力。{廣州俱(ju)進精密(mi)}多(duo)品(pin)(pin)種、中小(xiao)批量(liang)(liang)、高(gao)(gao)(gao)(gao)(gao)質(zhi)量(liang)(liang)、快速交(jiao)付，專注于線路板制造與貼(tie)片(pian)加(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(gong)(gong)領域(yu)，加(jia)(jia)(jia)急件(jian)交(jiao)付率(lv)高(gao)(gao)(gao)(gao)(gao)達99%，滿足(zu)客戶所急需(xu)。

貼(tie)片(pian)加(jia)工中元器(qi)件(jian)移位的(de)原因復雜，包括振動、溫度變化、操作失誤、材料質量(liang)(liang)、焊接問(wen)題及(ji)其他(ta)因素(su)。為(wei)提(ti)升(sheng)產(chan)品質量(liang)(liang)，需提(ti)高(gao)貼(tie)片(pian)精(jing)度、培訓操作人員、把控材料質量(liang)(liang)、優化PCB設計(ji)等多(duo)方面(mian)入手。以下是對貼(tie)片(pian)加(jia)工中元器(qi)件(jian)移位原因的(de)深(shen)度解析：

五、焊接問題導致的移位

焊接(jie)(jie)過程(cheng)中(zhong)的(de)(de)熱(re)應(ying)力(li)：在焊接(jie)(jie)過程(cheng)中(zhong)，由于熱(re)脹冷縮和熱(re)應(ying)力(li)的(de)(de)作用，可能(neng)導致元(yuan)器件(jian)發(fa)生微小的(de)(de)移(yi)位。

焊(han)(han)接(jie)質量不(bu)(bu)(bu)佳：如(ru)果焊(han)(han)接(jie)質量不(bu)(bu)(bu)好(hao)，如(ru)焊(han)(han)點不(bu)(bu)(bu)飽滿、虛焊(han)(han)等，那么在后續的使用過程中，元器件很容易因為焊(han)(han)接(jie)不(bu)(bu)(bu)牢固而發生(sheng)移(yi)位。

六(liu)、其他(ta)因素導致的移位

靜(jing)電(dian)影響：靜(jing)電(dian)可能導致(zhi)元器件在貼片(pian)過程中發(fa)生微小的移動或旋(xuan)轉。

設計(ji)問題：如果PCB板的(de)設計(ji)不(bu)合理，如元(yuan)(yuan)器件布(bu)局(ju)過(guo)(guo)于緊湊、缺乏必要的(de)固定措施等，也可能導(dao)致元(yuan)(yuan)器件在使用(yong)過(guo)(guo)程中發生移位。

為了避免元器件移位的發生，需要(yao)從多個方面入手進行控制和(he)改進，包括提高貼片機的精度和(he)穩定性、加強操作人員的培訓和(he)管(guan)理、嚴格(ge)把控原材料的質量、優化PCB板的設計等。

一、板(ban)(ban)材(cai)質(zhi)量(liang)(liang)(liang)① 通(tong)過(guo)(guo)化學(xue)分(fen)析(xi)方法，檢(jian)(jian)測(ce)PCB板(ban)(ban)材(cai)的(de)(de)(de)(de)(de)材(cai)質(zhi)和(he)成分(fen)是(shi)否(fou)(fou)符合標準。② 檢(jian)(jian)查(cha)板(ban)(ban)材(cai)的(de)(de)(de)(de)(de)內部結構，如纖維排列是(shi)否(fou)(fou)整齊，有無分(fen)層(ceng)或(huo)氣(qi)泡。二、導電(dian)(dian)性(xing)(xing)能(neng)檢(jian)(jian)測(ce)① 使用(yong)四探針測(ce)試(shi)(shi)儀(yi)等設(she)備，前(qian)沿制造PCBA加(jia)工(gong)代工(gong)工(gong)廠，測(ce)量(liang)(liang)(liang)PCB的(de)(de)(de)(de)(de)導電(dian)(dian)性(xing)(xing)能(neng)，確(que)保(bao)其(qi)滿(man)足電(dian)(dian)路(lu)(lu)設(she)計(ji)的(de)(de)(de)(de)(de)要求。② 檢(jian)(jian)查(cha)導電(dian)(dian)路(lu)(lu)徑是(shi)否(fou)(fou)清(qing)晰，無斷路(lu)(lu)或(huo)短路(lu)(lu)現(xian)象(xiang)。三(san)、絕緣性(xing)(xing)能(neng)檢(jian)(jian)測(ce)① 通(tong)過(guo)(guo)高(gao)(gao)(gao)壓測(ce)試(shi)(shi)設(she)備，檢(jian)(jian)測(ce)PCB的(de)(de)(de)(de)(de)絕緣層(ceng)是(shi)否(fou)(fou)能(neng)承(cheng)受規(gui)定(ding)的(de)(de)(de)(de)(de)電(dian)(dian)壓而不被擊穿。② 檢(jian)(jian)查(cha)絕緣材(cai)料是(shi)否(fou)(fou)均(jun)勻涂覆(fu)在導電(dian)(dian)層(ceng)之間，無漏涂或(huo)薄厚不均(jun)現(xian)象(xiang)。四、熱(re)(re)性(xing)(xing)能(neng)測(ce)試(shi)(shi)① 對PCB進(jin)行(xing)熱(re)(re)沖擊和(he)熱(re)(re)循環測(ce)試(shi)(shi)，以(yi)評估(gu)其(qi)在溫(wen)度(du)條(tiao)件下的(de)(de)(de)(de)(de)穩定(ding)性(xing)(xing)和(he)可靠(kao)性(xing)(xing)。② 檢(jian)(jian)查(cha)PCB在高(gao)(gao)(gao)溫(wen)下是(shi)否(fou)(fou)出現(xian)變形、開裂或(huo)分(fen)層(ceng)等問題。五、環境適(shi)應(ying)性(xing)(xing)測(ce)試(shi)(shi)① 對PCB進(jin)行(xing)鹽霧測(ce)試(shi)(shi)、霉(mei)菌測(ce)試(shi)(shi)等，以(yi)評估(gu)其(qi)在惡劣環境下的(de)(de)(de)(de)(de)耐久性(xing)(xing)。② 模擬PCB在振動、沖擊等機械應(ying)力下的(de)(de)(de)(de)(de)表現(xian)，檢(jian)(jian)查(cha)其(qi)結構強度(du)和(he)穩定(ding)性(xing)(xing)。{廣州(zhou)俱進(jin)精密}多(duo)品種、中小(xiao)批量(liang)(liang)(liang)、高(gao)(gao)(gao)質(zhi)量(liang)(liang)(liang)、快(kuai)速交付，專注于線(xian)路(lu)(lu)板(ban)(ban)制造與貼(tie)片加(jia)工(gong)領域，加(jia)急(ji)件交付率高(gao)(gao)(gao)達99%，滿(man)足客戶所急(ji)需(xu)。