隨著VLSI、電(dian)子(zi)零(ling)件(jian)的(de)小(xiao)(xiao)型化、高(gao)集積(ji)化的(de)進(jin)展，多(duo)層板(ban)(ban)(ban)價格，多(duo)層板(ban)(ban)(ban)多(duo)朝(chao)搭配高(gao)功能電(dian)路(lu)(lu)(lu)的(de)方向前進(jin)，是(shi)故對高(gao)密(mi)度線路(lu)(lu)(lu)、高(gao)布(bu)線容量的(de)需求(qiu)(qiu)日殷，甘(gan)肅多(duo)層板(ban)(ban)(ban)，也連(lian)帶地對電(dian)氣特(te)性（如Crosstalk、阻抗(kang)特(te)性的(de)整合(he)）的(de)要(yao)求(qiu)(qiu)更趨嚴格。而多(duo)腳數零(ling)件(jian)、表面(mian)組裝元(yuan)件(jian)（SMD）的(de)盛行，使(shi)得(de)電(dian)路(lu)(lu)(lu)板(ban)(ban)(ban)線路(lu)(lu)(lu)圖案(an)的(de)形(xing)(xing)狀更復雜、導體線路(lu)(lu)(lu)及孔徑更細(xi)小(xiao)(xiao)，且(qie)朝(chao)高(gao)多(duo)層板(ban)(ban)(ban)（10~15層）的(de)開發(fa)蔚為(wei)風氣。1980年代(dai)后半(ban)，實(shi)木多(duo)層板(ban)(ban)(ban)，為(wei)符合(he)小(xiao)(xiao)型、輕量化需求(qiu)(qiu)的(de)高(gao)密(mi)度布(bu)線、小(xiao)(xiao)孔走勢，0.4~0.6 mm厚(hou)的(de)薄形(xing)(xing)多(duo)層板(ban)(ban)(ban)則(ze)逐漸普(pu)及。以沖孔加工方式完(wan)成零(ling)件(jian)導孔及外形(xing)(xing)。此外，部份少量多(duo)樣(yang)生產的(de)產品(pin)，則(ze)采(cai)用感光阻劑形(xing)(xing)成圖樣(yang)的(de)照相法。

③　板(ban)(ban)(ban)坯成(cheng)型(xing)有濕(shi)法成(cheng)型(xing)與干法成(cheng)型(xing)兩(liang)大類(lei)，軟質(zhi)(zhi)板(ban)(ban)(ban)和大部分硬質(zhi)(zhi)板(ban)(ban)(ban)用(yong)濕(shi)法成(cheng)型(xing)；中密(mi)度板(ban)(ban)(ban)及部分硬質(zhi)(zhi)板(ban)(ban)(ban)用(yong)干法成(cheng)型(xing)。

濕(shi)法(fa)成型(xing)用(yong)低濃(nong)度漿料，經逐漸脫(tuo)水(shui)(shui)而成板(ban)(ban)坯(pi)，其基本方法(fa)有箱框(kuang)成型(xing)、長網(wang)(wang)(wang)成型(xing)、圓網(wang)(wang)(wang)成型(xing) 3種。箱框(kuang)成型(xing)是(shi)把濃(nong)度約為 1%的漿料由漿泵(beng)送入一個放在(zai)墊(dian)網(wang)(wang)(wang)上的無底箱框(kuang)內(nei)，在(zai)箱底用(yong)真(zhen)(zhen)空(kong)脫(tuo)水(shui)(shui)，箱框(kuang)頂(ding)部用(yong)加壓脫(tuo)水(shui)(shui)，此(ci)法(fa)主(zhu)要用(yong)于生(sheng)產軟質(zhi)纖維板(ban)(ban)。長網(wang)(wang)(wang)成型(xing)所用(yong)設備與造紙工業中(zhong)長網(wang)(wang)(wang)抄(chao)(chao)紙機類似(si)。1.2～2.0%濃(nong)度的漿料從(cong)網(wang)(wang)(wang)前(qian)箱抄(chao)(chao)上長網(wang)(wang)(wang)，經自(zi)重脫(tuo)水(shui)(shui)、真(zhen)(zhen)空(kong)脫(tuo)水(shui)(shui)、輥筒壓榨脫(tuo)水(shui)(shui)而形成濕(shi)板(ban)(ban)坯(pi)，含水(shui)(shui)率為65～70%。圓網(wang)(wang)(wang)成型(xing)也是(shi)從(cong)造紙工業中(zhong)移植(zhi)過來(lai)，在(zai)纖維板(ban)(ban)生(sheng)產中(zhong)常用(yong)的是(shi)真(zhen)(zhen)空(kong)式單(dan)圓網(wang)(wang)(wang)型(xing)，漿料濃(nong)度為0.75～1.5%，由真(zhen)(zhen)空(kong)作用(yong)漿料吸附于圓網(wang)(wang)(wang)上，經輥筒加壓脫(tuo)水(shui)(shui)并控制(zhi)板(ban)(ban)坯(pi)厚度。

軟質纖(xian)(xian)維(wei)(wei)板(ban)(ban)(ban)和(he)采用(yong)濕(shi)法(fa)成型干(gan)熱壓(ya)(ya)工藝（又(you)稱濕(shi)干(gan)法(fa)）的(de)硬質纖(xian)(xian)維(wei)(wei)板(ban)(ban)(ban)，其板(ban)(ban)(ban)坯都要經(jing)過干(gan)燥(zao)。干(gan)燥(zao)設備有間歇(xie)式和(he)連續式兩(liang)大(da)類。干(gan)燥(zao) 1千克(ke)水(shui)消耗(hao)1.6～1.8千克(ke)蒸氣。軟質纖(xian)(xian)維(wei)(wei)板(ban)(ban)(ban)坯干(gan)燥(zao)后的(de)終含水(shui)率為1～3%。用(yong)濕(shi)干(gan)法(fa)制造硬質纖(xian)(xian)維(wei)(wei)板(ban)(ban)(ban)時，多層板(ban)(ban)(ban)規格，板(ban)(ban)(ban)坯含水(shui)率不(bu)宜(yi)太高，否則熱壓(ya)(ya)時易于發生鼓泡在熱壓(ya)(ya)過程中(zhong)，板(ban)(ban)(ban)坯的(de)表層與芯層會出現(xian)溫差(cha)，厚度較大(da)的(de)中(zhong)密(mi)度板(ban)(ban)(ban)坯表芯層溫差(cha)可(ke)達(da)40～60℃，影響(xiang)芯層樹(shu)脂固(gu)化率。可(ke)用(yong)常規加熱和(he)高頻加熱消除溫差(cha)，并縮短熱壓(ya)(ya)周期。