**集(ji)(ji)(ji)成(cheng)電(dian)路(lu)(lu)：從(cong)芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)到(dao)(dao)系(xi)統(tong)，解(jie)決(jue)(jue)方(fang)案(an)(an)！**集(ji)(ji)(ji)成(cheng)電(dian)路(lu)(lu)（IntegratedCircuit，IC）作為現(xian)(xian)代信(xin)息技(ji)術(shu)(shu)的(de)(de)(de)(de)(de)基(ji)石，通(tong)(tong)過(guo)將(jiang)(jiang)(jiang)數(shu)以億計(ji)的(de)(de)(de)(de)(de)晶體管(guan)集(ji)(ji)(ji)成(cheng)在(zai)(zai)微小硅片(pian)(pian)(pian)(pian)(pian)上，推動(dong)了(le)從(cong)消費(fei)電(dian)子(zi)到(dao)(dao)人工智(zhi)能(neng)的(de)(de)(de)(de)(de)革新(xin)。隨(sui)著摩(mo)爾定律逼近物理(li)(li)(li)極限，行業(ye)正(zheng)從(cong)單(dan)純(chun)追求(qiu)工藝制(zhi)程(cheng)的(de)(de)(de)(de)(de)微縮，轉向以系(xi)統(tong)級思維重構(gou)(gou)技(ji)術(shu)(shu)路(lu)(lu)徑，提供更、更智(zhi)能(neng)的(de)(de)(de)(de)(de)解(jie)決(jue)(jue)方(fang)案(an)(an)。###**從(cong)芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)設計(ji)到(dao)(dao)系(xi)統(tong)集(ji)(ji)(ji)成(cheng)**傳(chuan)統(tong)芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)設計(ji)聚焦單(dan)一功能(neng)優(you)化(hua)，例如(ru)CPU、GPU或存儲(chu)單(dan)元(yuan)。然而(er)，隨(sui)著應(ying)用場景復雜(za)化(hua)，單(dan)一芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)難以滿足多(duo)元(yuan)化(hua)需(xu)(xu)求(qiu)，系(xi)統(tong)級芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)（SoC）應(ying)運而(er)生。SoC通(tong)(tong)過(guo)異(yi)構(gou)(gou)集(ji)(ji)(ji)成(cheng)技(ji)術(shu)(shu)，將(jiang)(jiang)(jiang)處(chu)理(li)(li)(li)器(qi)、內存、傳(chuan)感(gan)器(qi)等模塊整合(he)(he)(he)，顯著降低(di)(di)功耗與(yu)(yu)(yu)延遲。例如(ru)，智(zhi)能(neng)手機SoC融(rong)合(he)(he)(he)通(tong)(tong)信(xin)、圖像(xiang)處(chu)理(li)(li)(li)與(yu)(yu)(yu)AI加速(su)(su)功能(neng)，成(cheng)為移動(dong)終(zhong)端(duan)的(de)(de)(de)(de)(de)“大腦”。更進一步的(de)(de)(de)(de)(de)突破(po)在(zai)(zai)于封裝(zhuang)技(ji)術(shu)(shu)。2.5D/3D封裝(zhuang)通(tong)(tong)過(guo)硅通(tong)(tong)孔（TSV）將(jiang)(jiang)(jiang)多(duo)芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)垂直堆疊，突破(po)平面布線(xian)限制(zhi)，實(shi)(shi)現(xian)(xian)帶寬與(yu)(yu)(yu)能(neng)效的(de)(de)(de)(de)(de)躍升。例如(ru)，計(ji)算芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)采用Chiplet（小芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)）架(jia)構(gou)(gou)，將(jiang)(jiang)(jiang)不同(tong)(tong)工藝節點的(de)(de)(de)(de)(de)模塊組(zu)合(he)(he)(he)，兼顧性能(neng)與(yu)(yu)(yu)成(cheng)本(ben)。###**解(jie)決(jue)(jue)方(fang)案(an)(an)驅動(dong)應(ying)用場景**集(ji)(ji)(ji)成(cheng)電(dian)路(lu)(lu)的(de)(de)(de)(de)(de)價值終(zhong)體現(xian)(xian)在(zai)(zai)解(jie)決(jue)(jue)實(shi)(shi)際問題。在(zai)(zai)AI領域，芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)（如(ru)TPU、NPU）通(tong)(tong)過(guo)定制(zhi)化(hua)架(jia)構(gou)(gou)加速(su)(su)深度學習(xi)，使邊緣設備實(shi)(shi)現(xian)(xian)實(shi)(shi)時推理(li)(li)(li)；在(zai)(zai)物聯網(wang)中，低(di)(di)功耗MCU與(yu)(yu)(yu)無(wu)(wu)線(xian)通(tong)(tong)信(xin)芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)的(de)(de)(de)(de)(de)結合(he)(he)(he)，構(gou)(gou)建了(le)智(zhi)慧城市與(yu)(yu)(yu)工業(ye)4.0的(de)(de)(de)(de)(de)感(gan)知網(wang)絡；自動(dong)駕駛則依(yi)賴(lai)傳(chuan)感(gan)器(qi)融(rong)合(he)(he)(he)芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)，實(shi)(shi)時處(chu)理(li)(li)(li)激(ji)光雷達(da)、攝(she)像(xiang)頭等多(duo)源數(shu)據(ju)。解(jie)決(jue)(jue)方(fang)案(an)(an)的(de)(de)(de)(de)(de)競爭力(li)不僅(jin)依(yi)賴(lai)硬(ying)件(jian)創新(xin)，還需(xu)(xu)軟硬(ying)件(jian)協(xie)同(tong)(tong)優(you)化(hua)。例如(ru)，通(tong)(tong)過(guo)編譯器(qi)優(you)化(hua)釋放(fang)(fang)芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)算力(li)，或利用算法壓縮模型以適應(ying)嵌入(ru)式(shi)系(xi)統(tong)。###**未來：開(kai)放(fang)(fang)生態與(yu)(yu)(yu)跨界融(rong)合(he)(he)(he)**面對多(duo)元(yuan)化(hua)需(xu)(xu)求(qiu)，集(ji)(ji)(ji)成(cheng)電(dian)路(lu)(lu)行業(ye)正(zheng)走(zou)向開(kai)放(fang)(fang)協(xie)作。RISC-V開(kai)源指令集(ji)(ji)(ji)降低(di)(di)了(le)芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)設計(ji)門檻，加速(su)(su)定制(zhi)化(hua)芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)開(kai)發(fa)；新(xin)材料（如(ru)GaN、SiC）與(yu)(yu)(yu)存算一體架(jia)構(gou)(gou)突破(po)傳(chuan)統(tong)瓶頸(jing)。同(tong)(tong)時，芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)企業(ye)與(yu)(yu)(yu)終(zhong)端(duan)廠商深度合(he)(he)(he)作，從(cong)需(xu)(xu)求(qiu)端(duan)定義技(ji)術(shu)(shu)路(lu)(lu)線(xian)，例如(ru)元(yuan)宇宙對高算力(li)低(di)(di)延遲芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)的(de)(de)(de)(de)(de)需(xu)(xu)求(qiu)催生新(xin)型GPU架(jia)構(gou)(gou)。從(cong)微觀晶體管(guan)到(dao)(dao)宏(hong)觀系(xi)統(tong)，集(ji)(ji)(ji)成(cheng)電(dian)路(lu)(lu)的(de)(de)(de)(de)(de)演進始(shi)終(zhong)圍繞(rao)“解(jie)決(jue)(jue)問題”的(de)(de)(de)(de)(de)。未來，隨(sui)著AI、計(ji)算等技(ji)術(shu)(shu)的(de)(de)(de)(de)(de)融(rong)合(he)(he)(he)，芯(xin)(xin)(xin)(xin)片(pian)(pian)(pian)(pian)(pian)將(jiang)(jiang)(jiang)更深度嵌入(ru)人類生活，成(cheng)為智(zhi)能(neng)時代無(wu)(wu)處(chu)不在(zai)(zai)的(de)(de)(de)(de)(de)“使能(neng)者”。

集成(cheng)電(dian)路(lu)，作(zuo)為(wei)現代信息技(ji)(ji)(ji)術(shu)的(de)(de)(de)(de)(de)(de)基(ji)石之一，正以(yi)的(de)(de)(de)(de)(de)(de)力(li)(li)量(liang)助力(li)(li)產(chan)業升級與轉型。在(zai)(zai)數字(zi)化(hua)轉型的(de)(de)(de)(de)(de)(de)大(da)潮中，它們扮演著(zhu)至關(guan)重要的(de)(de)(de)(de)(de)(de)角色，不(bu)僅推動(dong)著(zhu)信息技(ji)(ji)(ji)術(shu)產(chan)業的(de)(de)(de)(de)(de)(de)飛速(su)發展，印刷電(dian)阻片(pian)報價，更為(wei)智能(neng)(neng)(neng)制(zhi)造、物(wu)聯網、大(da)數據等新(xin)興領域(yu)提供了強(qiang)大(da)的(de)(de)(de)(de)(de)(de)技(ji)(ji)(ji)術(shu)支撐和(he)動(dong)力(li)(li)源泉。隨著(zhu)科技(ji)(ji)(ji)的(de)(de)(de)(de)(de)(de)不(bu)斷進步和(he)應(ying)(ying)用(yong)需求(qiu)的(de)(de)(de)(de)(de)(de)日益多樣化(hua)，集成(cheng)電(dian)路(lu)的(de)(de)(de)(de)(de)(de)設計與生產(chan)水平(ping)也(ye)(ye)在(zai)(zai)持續提升。這些高度集成(cheng)的(de)(de)(de)(de)(de)(de)電(dian)子元件(jian)以(yi)其的(de)(de)(de)(de)(de)(de)性能(neng)(neng)(neng)穩定性和(he)高度的(de)(de)(de)(de)(de)(de)可靠性成(cheng)為(wei)眾多高科技(ji)(ji)(ji)產(chan)品的(de)(de)(de)(de)(de)(de)組件(jian)。從智能(neng)(neng)(neng)手機到(dao)云計算中心再(zai)到(dao)自動(dong)駕駛汽(qi)車等前沿應(ying)(ying)用(yong)場景(jing)都離不(bu)開它們的(de)(de)(de)(de)(de)(de)身影(ying)。通(tong)過不(bu)斷優化(hua)電(dian)路(lu)結構和(he)提高制(zhi)造工藝精度，我們可以(yi)進一步挖(wa)掘其潛力(li)(li)并拓(tuo)展應(ying)(ying)用(yong)范圍從而推動(dong)整(zheng)個產(chan)業鏈的(de)(de)(de)(de)(de)(de)升級與創新(xin)發展。展望未(wei)來可以(yi)預見的(de)(de)(de)(de)(de)(de)是：隨著(zhu)5G通(tong)信技(ji)(ji)(ji)術(shu)的(de)(de)(de)(de)(de)(de)鋪開以(yi)及(ji)人工智能(neng)(neng)(neng)領域(yu)的(de)(de)(de)(de)(de)(de)持續深耕細作(zuo)；對于計算能(neng)(neng)(neng)力(li)(li)和(he)低功耗設計要求(qiu)將越來越嚴格(ge)這無疑(yi)將對我們的(de)(de)(de)(de)(de)(de)研發能(neng)(neng)(neng)力(li)(li)提出更高要求(qiu)同時(shi)也(ye)(ye)意味著(zhu)更廣闊的(de)(de)(de)(de)(de)(de)發展空(kong)間和(he)市場機遇！讓我們攜手共進把(ba)握時(shi)代脈搏共同書寫屬于中國乃至半導體產(chan)業的(de)(de)(de)(de)(de)(de)新(xin)篇章吧!

**集(ji)(ji)成(cheng)電(dian)(dian)(dian)路(lu)：驅(qu)動(dong)產(chan)(chan)業(ye)(ye)(ye)(ye)(ye)(ye)升(sheng)(sheng)級(ji)(ji)的(de)(de)引擎**在(zai)(zai)科(ke)技(ji)(ji)(ji)競爭日(ri)益激烈的(de)(de)背景下(xia)，傳(chuan)感(gan)器厚(hou)膜電(dian)(dian)(dian)阻(zu)片(pian)(pian)，集(ji)(ji)成(cheng)電(dian)(dian)(dian)路(lu)作為現代(dai)工(gong)(gong)(gong)業(ye)(ye)(ye)(ye)(ye)(ye)的(de)(de)“糧食”，正(zheng)成(cheng)為推動(dong)產(chan)(chan)業(ye)(ye)(ye)(ye)(ye)(ye)升(sheng)(sheng)級(ji)(ji)的(de)(de)動(dong)力。從智(zhi)能(neng)(neng)(neng)手機(ji)到(dao)人(ren)工(gong)(gong)(gong)智(zhi)能(neng)(neng)(neng)，從新(xin)能(neng)(neng)(neng)源(yuan)汽車(che)到(dao)工(gong)(gong)(gong)業(ye)(ye)(ye)(ye)(ye)(ye)互(hu)聯(lian)網，集(ji)(ji)成(cheng)電(dian)(dian)(dian)路(lu)的(de)(de)技(ji)(ji)(ji)術突破(po)直接決(jue)定了產(chan)(chan)業(ye)(ye)(ye)(ye)(ye)(ye)創新(xin)的(de)(de)高度(du)與(yu)速度(du)。當(dang)前，中(zhong)(zhong)國(guo)(guo)正(zheng)以(yi)(yi)芯片(pian)(pian)為支點，撬動(dong)制(zhi)造(zao)(zao)業(ye)(ye)(ye)(ye)(ye)(ye)向智(zhi)能(neng)(neng)(neng)化(hua)(hua)、化(hua)(hua)躍(yue)遷(qian)，加(jia)速構(gou)(gou)(gou)建(jian)新(xin)發展(zhan)格局(ju)。###技(ji)(ji)(ji)術突破(po)：產(chan)(chan)業(ye)(ye)(ye)(ye)(ye)(ye)鏈(lian)整體躍(yue)升(sheng)(sheng)集(ji)(ji)成(cheng)電(dian)(dian)(dian)路(lu)的(de)(de)研(yan)發與(yu)量(liang)產(chan)(chan)，是打破(po)“卡脖子”瓶(ping)頸的(de)(de)關鍵(jian)。以(yi)(yi)5納米(mi)、3納米(mi)制(zhi)程為代(dai)表(biao)(biao)的(de)(de)芯片(pian)(pian)工(gong)(gong)(gong)藝，不僅大(da)幅(fu)提升(sheng)(sheng)計(ji)算效率，更催生(sheng)了自動(dong)駕(jia)駛、元(yuan)宇宙等(deng)(deng)新(xin)興(xing)場(chang)(chang)景。例如，華為海思的(de)(de)昇騰AI芯片(pian)(pian)已實(shi)現國(guo)(guo)產(chan)(chan)化(hua)(hua)替(ti)代(dai)，支撐國(guo)(guo)內AI大(da)模(mo)(mo)型訓練效率提升(sheng)(sheng)40%以(yi)(yi)上。同時，第(di)三代(dai)半(ban)導(dao)體材(cai)料(liao)(liao)（碳化(hua)(hua)硅、氮化(hua)(hua)）的(de)(de)突破(po)，推動(dong)新(xin)能(neng)(neng)(neng)源(yuan)汽車(che)電(dian)(dian)(dian)控系(xi)統效能(neng)(neng)(neng)提升(sheng)(sheng)30%，助(zhu)力中(zhong)(zhong)國(guo)(guo)車(che)企搶占市場(chang)(chang)先機(ji)。這些技(ji)(ji)(ji)術突破(po)形成(cheng)“鏈(lian)式反應”，印刷(shua)電(dian)(dian)(dian)阻(zu)片(pian)(pian)訂做，帶動(dong)設備(bei)、材(cai)料(liao)(liao)、設計(ji)軟件等(deng)(deng)上下(xia)游協同升(sheng)(sheng)級(ji)(ji)。###生(sheng)態重構(gou)(gou)(gou)：從單一(yi)創新(xin)到(dao)系(xi)統突圍產(chan)(chan)業(ye)(ye)(ye)(ye)(ye)(ye)升(sheng)(sheng)級(ji)(ji)需要(yao)構(gou)(gou)(gou)建(jian)完整的(de)(de)創新(xin)生(sheng)態。中(zhong)(zhong)國(guo)(guo)通過(guo)“大(da)+產(chan)(chan)業(ye)(ye)(ye)(ye)(ye)(ye)集(ji)(ji)群”模(mo)(mo)式，在(zai)(zai)長三角(jiao)、粵(yue)港(gang)澳等(deng)(deng)地形成(cheng)覆蓋設計(ji)、制(zhi)造(zao)(zao)、封(feng)測的(de)(de)全產(chan)(chan)業(ye)(ye)(ye)(ye)(ye)(ye)鏈(lian)條。中(zhong)(zhong)芯國(guo)(guo)際28納米(mi)成(cheng)熟(shu)制(zhi)程產(chan)(chan)能(neng)(neng)(neng)位居，長電(dian)(dian)(dian)科(ke)技(ji)(ji)(ji)在(zai)(zai)封(feng)裝領域(yu)躋身國(guo)(guo)際梯隊(dui)。更值(zhi)得(de)注(zhu)意的(de)(de)是，以(yi)(yi)“芯粒(li)”（Chiplet）技(ji)(ji)(ji)術為代(dai)表(biao)(biao)的(de)(de)異構(gou)(gou)(gou)集(ji)(ji)成(cheng)方案，正(zheng)在(zai)(zai)改寫行業(ye)(ye)(ye)(ye)(ye)(ye)規則——通過(guo)模(mo)(mo)塊(kuai)化(hua)(hua)設計(ji)繞(rao)開制(zhi)程限制(zhi)，國(guo)(guo)內企業(ye)(ye)(ye)(ye)(ye)(ye)已實(shi)現7nm等(deng)(deng)效性(xing)能(neng)(neng)(neng)芯片(pian)(pian)量(liang)產(chan)(chan)，為半(ban)導(dao)體產(chan)(chan)業(ye)(ye)(ye)(ye)(ye)(ye)開辟(pi)“換道超車(che)”新(xin)路(lu)徑(jing)。###數(shu)實(shi)融(rong)合(he)：賦能(neng)(neng)(neng)千行百業(ye)(ye)(ye)(ye)(ye)(ye)智(zhi)能(neng)(neng)(neng)化(hua)(hua)芯片(pian)(pian)的(de)(de)應用場(chang)(chang)景正(zheng)從消費(fei)電(dian)(dian)(dian)子向工(gong)(gong)(gong)業(ye)(ye)(ye)(ye)(ye)(ye)領域(yu)縱深拓(tuo)展(zhan)。工(gong)(gong)(gong)業(ye)(ye)(ye)(ye)(ye)(ye)控制(zhi)芯片(pian)(pian)使機(ji)床加(jia)工(gong)(gong)(gong)精度(du)達到(dao)微米(mi)級(ji)(ji)，物(wu)聯(lian)網芯片(pian)(pian)連接超200億(yi)終端設備(bei)，華龍(long)印刷(shua)電(dian)(dian)(dian)阻(zu)片(pian)(pian)，構(gou)(gou)(gou)建(jian)起智(zhi)慧工(gong)(gong)(gong)廠的(de)(de)數(shu)字底座。在(zai)(zai)蘇州工(gong)(gong)(gong)業(ye)(ye)(ye)(ye)(ye)(ye)園(yuan)，搭載(zai)國(guo)(guo)產(chan)(chan)AI芯片(pian)(pian)的(de)(de)質(zhi)檢(jian)系(xi)統將產(chan)(chan)品缺陷識(shi)別率提升(sheng)(sheng)至99.98%，人(ren)力成(cheng)本下(xia)降70%。這種“芯片(pian)(pian)+算法(fa)+場(chang)(chang)景”的(de)(de)融(rong)合(he)創新(xin)，正(zheng)在(zai)(zai)重塑制(zhi)造(zao)(zao)業(ye)(ye)(ye)(ye)(ye)(ye)的(de)(de)價值(zhi)鏈(lian)。據(ju)數(shu)據(ju)，2023年中(zhong)(zhong)國(guo)(guo)集(ji)(ji)成(cheng)電(dian)(dian)(dian)路(lu)行業(ye)(ye)(ye)(ye)(ye)(ye)營收突破(po)1.5萬億(yi)元(yuan)，自給率較五年前翻(fan)倍(bei)，但(dan)芯片(pian)(pian)對外(wai)依存度(du)仍超80%。這意味著，持續加(jia)大(da)研(yan)發投入（2023年全行業(ye)(ye)(ye)(ye)(ye)(ye)研(yan)發強度(du)達18%）、完善人(ren)才梯隊(dui)、深化(hua)(hua)國(guo)(guo)際合(he)作，才能(neng)(neng)(neng)在(zai)(zai)半(ban)導(dao)體產(chan)(chan)業(ye)(ye)(ye)(ye)(ye)(ye)變局(ju)中(zhong)(zhong)掌握(wo)主動(dong)權。當(dang)一(yi)粒(li)粒(li)芯片(pian)(pian)承(cheng)載(zai)起自主創新(xin)的(de)(de)希(xi)望(wang)，中(zhong)(zhong)國(guo)(guo)產(chan)(chan)業(ye)(ye)(ye)(ye)(ye)(ye)的(de)(de)升(sheng)(sheng)級(ji)(ji)之(zhi)路(lu)必將行穩致遠。