等離(li)(li)子拋(pao)(pao)光是一種前沿且的(de)(de)(de)(de)(de)表(biao)(biao)面(mian)處理(li)技(ji)術(shu)(shu)，它利用(yong)(yong)等離(li)(li)子體的(de)(de)(de)(de)(de)高能量和(he)(he)活性(xing)(xing)特(te)性(xing)(xing)對材(cai)料表(biao)(biao)面(mian)進行精(jing)細處理(li)。這(zhe)項技(ji)術(shu)(shu)主要(yao)適用(yong)(yong)于金屬、合金以及某些非金屬材(cai)料的(de)(de)(de)(de)(de)表(biao)(biao)面(mian)處理(li)領域(yu)，能夠(gou)有(you)效改善(shan)工(gong)件表(biao)(biao)面(mian)的(de)(de)(de)(de)(de)粗(cu)糙度和(he)(he)平整性(xing)(xing)。在等離(li)(li)子拋(pao)(pao)光過程(cheng)中，工(gong)作(zuo)氣(qi)體（如(ru)氣(qi)或氮氣(qi)）被電離(li)(li)形成(cheng)高溫高密度的(de)(de)(de)(de)(de)血漿體狀(zhuang)態(tai)——即“等離(li)(li)子體”。這(zhe)種高能狀(zhuang)態(tai)的(de)(de)(de)(de)(de)離(li)(li)子流(liu)與待處理(li)的(de)(de)(de)(de)(de)工(gong)件接觸時發生物(wu)理(li)和(he)(he)化(hua)學(xue)雙重作(zuo)用(yong)(yong)：一方(fang)面(mian)通過高速離(li)(li)子的(de)(de)(de)(de)(de)轟(hong)擊(ji)去除微(wei)小的(de)(de)(de)(de)(de)凸起部分(fen)；另一方(fang)面(mian)則(ze)借助化(hua)學(xue)反應生成(cheng)揮發性(xing)(xing)物(wu)質(zhi)(zhi)并(bing)隨氣(qi)流(liu)帶走(zou)雜質(zhi)(zhi)層從(cong)而達到平整效果。這(zhe)一過程(cheng)不僅控制(zhi)度高而且對環境友好污染小。相較于傳(chuan)統機械式(shi)打磨方(fang)法而言，等離(li)(li)子拋(pao)(pao)光具(ju)有(you)諸多(duo)優勢顯著之處：它能實現(xian)更為(wei)均(jun)勻細膩的(de)(de)(de)(de)(de)微(wei)觀形貌加工(gong)從(cong)而顯著提升產(chan)品的(de)(de)(de)(de)(de)外觀質(zhi)(zhi)量和(he)(he)使(shi)用(yong)(yong)性(xing)(xing)能；由于是非接觸式(shi)的(de)(de)(de)(de)(de)處理(li)方(fang)式(shi)避免了(le)工(gong)具(ju)磨損和(he)(he)材(cai)料應力集中的(de)(de)(de)(de)(de)問題提高了(le)工(gong)作(zuo)效率(lv)(lv)及成(cheng)品率(lv)(lv)。此外該技(ji)術(shu)(shu)還具(ju)備良好的(de)(de)(de)(de)(de)適應性(xing)(xing)和(he)(he)靈活性(xing)(xing)能夠(gou)針對不同(tong)材(cai)質(zhi)(zhi)不同(tong)形狀(zhuang)復雜結構的(de)(de)(de)(de)(de)零件進行有(you)效處理(li)滿(man)足多(duo)樣化(hua)需求為(wei)精(jing)密制(zhi)造(zao)和(he)(he)裝備制(zhi)造(zao)提供了(le)有(you)力支持。總(zong)之，隨著科學(xue)技(ji)術(shu)(shu)的(de)(de)(de)(de)(de)不斷進步和(he)(he)發展等離(li)(li)子拋(pao)(pao)光技(ji)術(shu)(shu)將會在更多(duo)領域(yu)內展現(xian)出其獨值和(he)(he)廣(guang)闊(kuo)應用(yong)(yong)前景

等(deng)(deng)離子(zi)電漿拋(pao)光(guang)(guang)機(ji)(ji)是一種基于低溫等(deng)(deng)離子(zi)體(ti)(ti)技(ji)術的精密表面(mian)(mian)處(chu)(chu)理(li)設備，通(tong)過(guo)電離氣(qi)體(ti)(ti)產生(sheng)的活性(xing)粒子(zi)實(shi)現(xian)材(cai)(cai)料表面(mian)(mian)的超(chao)精細加工(gong)。其原(yuan)理(li)是在真空(kong)環境下，利用高(gao)頻(pin)電場將惰性(xing)氣(qi)體(ti)(ti)（如氣(qi)）電離為(wei)(wei)等(deng)(deng)離子(zi)態，形成(cheng)高(gao)能電子(zi)、離子(zi)和自由(you)基的混合(he)體(ti)(ti)。這(zhe)些高(gao)活性(xing)粒子(zi)以物(wu)(wu)理(li)轟擊與化學蝕刻協(xie)同作用，逐層(ceng)剝離材(cai)(cai)料表面(mian)(mian)納米級(ji)凸起(qi)，達到原(yuan)子(zi)級(ji)平整(zheng)效果。工(gong)藝(yi)流程分為(wei)(wei)四個階段(duan)：首行(xing)預處(chu)(chu)理(li)，通(tong)過(guo)超(chao)聲(sheng)波清洗去除(chu)工(gong)件(jian)表面(mian)(mian)油(you)脂與顆粒；隨(sui)(sui)后在真空(kong)腔體(ti)(ti)內通(tong)入工(gong)藝(yi)氣(qi)體(ti)(ti)，施加射(she)頻(pin)電源激發穩(wen)定等(deng)(deng)離子(zi)體(ti)(ti)；接(jie)著(zhu)通(tong)過(guo)控(kong)制(zhi)(zhi)(zhi)氣(qi)體(ti)(ti)流量、功率及處(chu)(chu)理(li)時間（通(tong)常(chang)為(wei)(wei)5-30分鐘(zhong)），實(shi)現(xian)0.1-1μm的材(cai)(cai)料去除(chu)量；進行(xing)惰性(xing)氣(qi)體(ti)(ti)保(bao)護冷(leng)卻(que)，鋁(lv)(lv)拋(pao)光(guang)(guang)機(ji)(ji)，避免(mian)二次氧化。關(guan)鍵(jian)參(can)數包括(kuo)工(gong)作壓力（10-100Pa）、射(she)頻(pin)頻(pin)率（13.56MHz或2.45GHz）及溫度控(kong)制(zhi)(zhi)(zhi)（50-200℃）。該技(ji)術主要應用于航(hang)空(kong)航(hang)天精密部(bu)件(jian)、半導體(ti)(ti)晶圓、植入體(ti)(ti)及光(guang)(guang)學鏡(jing)片等(deng)(deng)領(ling)域，鋁(lv)(lv)拋(pao)光(guang)(guang)機(ji)(ji)廠，尤其擅長處(chu)(chu)理(li)不銹(xiu)鋼、鈦(tai)合(he)金等(deng)(deng)難加工(gong)材(cai)(cai)料。相較于傳統拋(pao)光(guang)(guang)，其優勢顯(xian)著(zhu)：非接(jie)觸(chu)式加工(gong)消除(chu)機(ji)(ji)械應力，可(ke)處(chu)(chu)理(li)復雜微結(jie)構；表面(mian)(mian)粗糙度可(ke)達Ra≤0.01μm，鋁(lv)(lv)拋(pao)光(guang)(guang)機(ji)(ji)報價，且無化學殘(can)留；能耗降低40%以上，廢棄物(wu)(wu)排放(fang)減少90%。隨(sui)(sui)著(zhu)5G精密零部(bu)件(jian)和微型(xing)需(xu)求增長，等(deng)(deng)離子(zi)拋(pao)光(guang)(guang)正逐步成(cheng)為(wei)(wei)制(zhi)(zhi)(zhi)造領(ling)域的關(guan)鍵(jian)表面(mian)(mian)處(chu)(chu)理(li)技(ji)術。

等(deng)離子(zi)不銹鋼拋(pao)(pao)光(guang)(guang)機操作(zuo)指南一、安全準(zhun)備1.佩戴防護(hu)裝備：防腐蝕(shi)手套、護(hu)目鏡(jing)、防塵口(kou)罩及絕(jue)緣(yuan)鞋2.檢(jian)(jian)(jian)查(cha)設備電(dian)(dian)(dian)源(yuan)(yuan)線路(lu)無破損，接地裝置可(ke)靠3.確(que)保工(gong)(gong)(gong)作(zuo)區域通(tong)風(feng)良好，配備消防器(qi)(qi)材(cai)4.電(dian)(dian)(dian)解(jie)(jie)(jie)(jie)液(ye)(ye)(ye)容器(qi)(qi)密封(feng)性(xing)檢(jian)(jian)(jian)查(cha)（酸(suan)堿液(ye)(ye)(ye)PH值控(kong)制在2.5-3.5）二、操作(zuo)流(liu)程(cheng)1.開(kai)機準(zhun)備：-接通(tong)380V三相電(dian)(dian)(dian)源(yuan)(yuan)，打(da)開(kai)主控(kong)開(kai)關(guan)(guan)-預熱(re)電(dian)(dian)(dian)源(yuan)(yuan)箱（約3-5分鐘）-檢(jian)(jian)(jian)查(cha)等(deng)離子(zi)發(fa)(fa)生(sheng)器(qi)(qi)壓力表(biao)（保持(chi)0.3-0.5MPa）2.工(gong)(gong)(gong)件(jian)(jian)處(chu)理(li)(li)：①裝夾定(ding)(ding)位：使(shi)用夾具固定(ding)(ding)工(gong)(gong)(gong)件(jian)(jian)，確(que)保導(dao)電(dian)(dian)(dian)接觸良好②參數設置：根據(ju)材(cai)料厚度調(diao)(diao)節電(dian)(dian)(dian)流(liu)（建議1.5-3A/dm2），頻率設為40-60kHz③電(dian)(dian)(dian)解(jie)(jie)(jie)(jie)液(ye)(ye)(ye)配置：按(an)1:3比(bi)例(li)稀(xi)釋拋(pao)(pao)光(guang)(guang)液(ye)(ye)(ye)，鋁件(jian)(jian)拋(pao)(pao)光(guang)(guang)機，液(ye)(ye)(ye)溫控(kong)制在35-45℃3.拋(pao)(pao)光(guang)(guang)作(zuo)業(ye)：-啟動(dong)循環泵使(shi)電(dian)(dian)(dian)解(jie)(jie)(jie)(jie)液(ye)(ye)(ye)流(liu)動(dong)-保持(chi)噴距工(gong)(gong)(gong)件(jian)(jian)10-15cm，45°角勻速移動(dong)-單次(ci)(ci)處(chu)理(li)(li)時間2-5分鐘（視(shi)表(biao)面粗(cu)糙(cao)度調(diao)(diao)整）4.過(guo)程(cheng)監控(kong)：①觀察電(dian)(dian)(dian)弧(hu)穩定(ding)(ding)性(xing)（應呈現連續藍紫色輝光(guang)(guang)）②定(ding)(ding)期檢(jian)(jian)(jian)測電(dian)(dian)(dian)解(jie)(jie)(jie)(jie)液(ye)(ye)(ye)濃度（比(bi)重計1.18-1.25g/cm3）③及時清理(li)(li)電(dian)(dian)(dian)極積碳（每(mei)4小(xiao)時清理(li)(li)一次(ci)(ci)）三、關(guan)(guan)機維(wei)護(hu)1.作(zuo)業(ye)完成(cheng)后關(guan)(guan)閉電(dian)(dian)(dian)源(yuan)(yuan)順序：先關(guan)(guan)等(deng)離子(zi)發(fa)(fa)生(sheng)器(qi)(qi)，再斷總電(dian)(dian)(dian)源(yuan)(yuan)2.用去離子(zi)水沖(chong)洗工(gong)(gong)(gong)件(jian)(jian)表(biao)面殘(can)留電(dian)(dian)(dian)解(jie)(jie)(jie)(jie)液(ye)(ye)(ye)3.清理(li)(li)電(dian)(dian)(dian)解(jie)(jie)(jie)(jie)槽沉淀物（每(mei)周至(zhi)少2次(ci)(ci)）4.電(dian)(dian)(dian)極保養：用細(xi)砂紙打(da)磨(mo)氧化層，涂抹導(dao)電(dian)(dian)(dian)膏注意事項：-禁止處(chu)理(li)(li)鍍(du)層或復(fu)合材(cai)質工(gong)(gong)(gong)件(jian)(jian)-突發(fa)(fa)異(yi)常（異(yi)味/異(yi)響）立即(ji)啟動(dong)急停(ting)按(an)鈕-每(mei)月檢(jian)(jian)(jian)測絕(jue)緣(yuan)電(dian)(dian)(dian)阻（≥5MΩ）-電(dian)(dian)(dian)解(jie)(jie)(jie)(jie)液(ye)(ye)(ye)更換(huan)周期不超過(guo)200工(gong)(gong)(gong)作(zuo)小(xiao)時遵循本規程(cheng)可(ke)確(que)保Ra0.1-0.4μm的表(biao)面光(guang)(guang)潔(jie)度，同時延長設備使(shi)用壽命。建議操作(zuo)時由(you)人員指導(dao)，逐(zhu)步(bu)掌(zhang)握參數調(diao)(diao)整技(ji)巧。